2 MB (GREET) Model Argonne National Laboratory
18 Energy consumption in the French process used in the production of zinc oxide .......25 .. data for metals production in GREET 2 for nickel, platinum, molybdenum, zinc, and silicon, with one .. the raw material is inexpensive. production of PGMs, gold, nickel, and copper in 2014 (Anglo American Platinum 2014).
Metal wafer substrates for semiconductor manufacturingPlansee
With our molybdenum and MoCu wafer substrates, a service life of 100 000the soldering process as well as for long term heat dissipation in LED chips.Our nickel gold coating is resistant to oxidation and protects the wafer carrier against corrosion.From the raw materials through to the finihed product: including the.Live Chat